Samsung is considering transferring the Exynos chip design responsibilities from its LSI division to the Mobile Experience (MX) division, which manages Galaxy smartphones. This shift aims to enhance chip performance and user experience, while Samsung’s Foundry will continue to manufacture the SoCs. However, there’s internal disagreement regarding the move, as restructuring demands careful planning. The motivation behind this consideration stems from LSI’s recent underperformance, having missed deadlines for the Galaxy S25 and S23 series Exynos chips, which often fall short compared to Qualcomm’s offerings. Additionally, Samsung Foundry faces challenges in keeping up with TSMC in manufacturing technology.
At present, Samsung’s LSI division is tasked with designing the Exynos chips. However, discussions within the company indicate a potential transfer of this responsibility to Samsung MX (Mobile Experience), the department overseeing Galaxy smartphones.
The rationale for this shift is to consolidate the chip design team within the Samsung MX division, enabling collaborative efforts to enhance the performance and overall user experience of Exynos chips. Nevertheless, Samsung’s Foundry business will continue to handle the manufacturing of the SoCs.
Nonetheless, there appears to be some internal dissent regarding this decision, according to reports. While some support the move, others are opposed. Ultimately, such a change demands extensive planning.
The motivation behind Samsung’s consideration of this transition likely stems from the subpar performance of Samsung LSI in recent years. The LSI division failed to meet the timeline for the Galaxy S25 series, resulting in a delayed delivery of the Exynos 2500, a problem echoed with the Galaxy S23 series. When the team does manage to deliver, the Exynos chip frequently falls short when compared to Qualcomm’s Snapdragon.
Even if the restructuring proceeds without a hitch, Samsung MX may encounter additional challenges related to the Samsung Foundry division. This sector has also struggled in recent years, facing difficulties in keeping pace with TSMC and falling behind in advanced manufacturing technologies.
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